To help customers stay ahead of market trends and optimize their product strategies, Longsys has officially announced the Longsys LMG 2026Q1 Product Roadmap. This latest update highlights advancements in process technology, the expansion of the automotive-grade product portfolio, and the introduction of cost-optimized, high-density storage solutions.
The key highlights of this quarter’s roadmap include:
1. Next-Generation SPI SLC NAND Process (4xnm)
Longsys continues to strengthen its technological capabilities with the introduction of the 4xsnm/4xnm process for 192Mb, 512Mb, and 1Gb SPI SLC NAND.
These products are specifically designed for the Industrial Plus segment, delivering stable performance and high reliability in demanding industrial environments.
2. Expansion of Automotive Grade 2 (G2) Portfolio
Longsys is further expanding its automotive product lineup. Notably, 1Gb and 2Gb SPI NAND have been officially added to the Automotive Grade 2 (G2) roadmap, leveraging the 4xnm process to meet stringent requirements for durability and stability in in-vehicle electronic systems.
Looking ahead, Longsys is also planning to develop 4Gb SPI NAND based on the 2xnm process for automotive applications, further strengthening its position in the intelligent vehicle storage market.
3. 192Mb & 512Mb SPI NAND – An Alternative to High-Density NOR Flash
The 192Mb and 512Mb SPI NAND products are emerging as effective alternatives to traditional high-density NOR Flash. With advantages in cost efficiency and scalability, SPI NAND provides a more flexible solution for device manufacturers.
At the same time, the increasing size of notebook BIOS files is driving demand for more efficient storage solutions. SPI NAND has already become a mainstream choice for Chromebooks, and it is المتوقع that between 2026 and 2028, this technology will gradually become the standard storage solution for notebook BIOS, replacing high-density NOR Flash.
